In recent years, with the rapid development of global security industry, optical network platform is widely used in the field of security, and China's VOOP market demand is also growing year by year. In addition to the security field, safe city, urban intelligent transportation, expressway, urban rail transit projects are also the main market of VOOP.

The increasing market demand of VOOP brings new requirements for optical fiber bandwidth capacity and equipment management. In order to meet the requirements of this change, as one of the core devices, the types of optical transceiver module are becoming more and more, the requirements are higher and higher, and the complexity is also developing at an amazing speed.

In the security market, 2.5G SFP optical module and CWDM optical module have been stably applied in VOOP. The connector of optical module has developed from ST, FC to SC and smaller LC, MT-RJ connector, and the packaging form of corresponding optical transceiver module has also developed from plastic packaging to metal packaging.

Pin arrangement and packaging has developed from single row 9-pin, double row 5-pin or 10-pin to golden finger. SFF (small form factor) small package optical module adopts advanced precision optics and circuit integration technology. The size of SFF small form factor is only half of that of common duplex SC (1x9) fiber transceiver module. In the same space, the number of optical ports can be doubled, the line port density can be increased, and the system cost per port can be reduced.

As the SFF small package module adopts the MT-RJ interface similar to copper network, and the size is the same as that of common computer network copper interface, which is conducive to the transition of existing network equipment based on copper cable to higher speed optical fiber network, so as to meet the rapid growth of network bandwidth demand. In specific applications, some optical terminal manufacturers are using the SFP module, and some manufacturers use single row 9-pin model Block and pigtail LC interface to achieve miniaturization.

The common 1.25G SFP optical modules on the market include:

With the popularization of optical fiber, the global optical communication market is developing towards the direction of all-optical network. The number of optical communication equipment is increasing, so the requirement of equipment volume is becoming smaller and smaller.

The interface board contains more and more interfaces, which further intensifies the density of equipment. In order to meet the requirements of communication equipment for optical devices, optical modules are developing into small package with high integration.

The smaller volume of communication equipment brings a problem of heat dissipation, which requires the development of optoelectronic devices to low power consumption. The current small package (SFF, SFP) optical modules have all used low voltage 3.3V power supply to ensure the normal operation of the system equipment.

Although in the current VOOP, single row 9-pin module occupies the majority of applications. However, as far as the development trend of modules is concerned, the optical modules with the above advantages have gradually become the mainstream optical modules.

As an optical module manufacturer, ETU-LINK has mature production technology of SFP optical module, providing high-quality SFP optical module for public security monitoring, traffic monitoring and other fields.

In the future, the hot spots of optical components are mainly concentrated in three parts: wide area network, access (PON) network and LAN/SAN network market. The active devices based on MSA module and PON network will be a very popular market. At the same time, with the rapid increase of metropolitan access and data communication, the emergence of SFP optical modules meets the needs of the subsequent development of video optical terminals and the growing communication system In the same way, smart SFP module technology represents the development trend of the new generation of optical modules, and is the cornerstone of the next generation of high-speed optical modules.